Headquartered in Singapore, Flextronics is a leading Electronics Manufacturing Services (EMS) provider focused on delivering complete design, engineering and manufacturing services to automotive, computing, consumer digital, industrial, infrastructure, medical and mobile OEMs. With the acquisition of Solectron, pro forma fiscal year 2007 revenues from continuing operations are more than US$30 billion. Flextronics helps customers design, build, ship, and service electronics products through a network of facilities in 35 countries on four continents. This global presence provides design and engineering solutions that are combined with core electronics manufacturing and logistics services, and vertically integrated with components technologies, to optimize customer operations by lowering costs and reducing time to market.
Senior / Component Engineer (Bukit Minyak)
Responsibilities:
Perform bench debug on component (ASIC/IC/Power/Discrete) failure at the card level and hand in the failure analysis into the silicon level.
Perform high-level characterization and categorization during debugging and troubleshooting of the failed components to determine the failure mechanism of the component (physical defect, marginal fault of intermittent failure)
Drive the root cause of the failure down to the silicon level
Link the production failure replacement rate on particular component with the high repair rate of the components from customers returns.
Reduce the replacement rate on particular components while escalate and ECO work is involved.
Characterize failures, determine the suspect corruption and margin defect inside components identify whether production coverage exists for the electrical failure signature.
Check/Confirm the pre-screen test coverage of the components on suppliers’ testers.
Follow up with suppliers’ PFA analysis and work with both suppliers an CDO FA until the root cause is identifies at the silicon level.
Monitor the RMA FA and RMA PFA of the suppliers, determine the root cause and provide recommended solutions for the process improvement
Monitor the components quality improvement; suggest the risk assessment bass on the trend of the customer returns and the yield analysis from both vendors & customers’ contract manufacturers
Work with CDO FA fir failure prevention effort, report any possible weak test coverage and help CDO FA, CM & CRM to improve debug testing,
Modify the board set up and test software set-up for ASIC/SOC failure isolation and silicon level debug
Requirements:
Masters/Degree in Electrical/Computer Engineering with min 5 years’ experience.
Experience in semiconductor design with testing and processing knowledge of system on chip, SIP, mixed signal chip, ASIC, memory chip, IC, DC power, discrete devices, CPLD/FPGA, board, system, REF and analog including OEM parts i.e power supply and PCB debugging skills.
Expert in using electronics lad equipment to do the board debug down to inside components.
Knowledge of bench-top equipment i.e logic analyzers, oscilloscope, bus analyzers, curve tracer and testers
Analog test and debug experience including power supply, power modules and discrete parts, RF and RF device test ys a plus
Good understanding of CMOS semiconductor device physics, circuit/ASIC design and board/component/Asic layout.
Knowledge of tools and methods related to the inspection & analysis of component and assemble parts
Experience in successfully solving problems when dealing with customers and suppliers
Knowledge of solid statistics and PFA, semiconductor testing & processing and board assembly processing, ATE test development,
Knowledge of efficient software/firmware/computer skills, including C,TCL & RTL code and simulation and network//switch/router
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