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Listed twenty two days ago

This is a Full time job

subClassification: Electrical/Electronic EngineeringElectrical/Electronic Engineering
classification: Engineering(Engineering)
  • Experience with PnP, AVI, Die Attach, Oven Cure, Plasma CureUV cure, TnR and etc
  • Well experience in troubleshooting and problem solving
  • Electrical, Electronic, Material or Mechanical and other Engineering field
22d ago
Listed two days ago

This is a Full time job

subClassification: Engineering - SoftwareEngineering - Software
classification: Information & Communication Technology(Information & Communication Technology)
  • Familiar with FOL Die attached and wire bond processes
  • Minimum 3 years of working experience in related field
  • Understand m/c performance measures and designs using engineering principles
2d ago
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