Listed twenty three days agoPrincipal Technology Development Engineer – Thermal-Compression Bonding (TCB)at FusionAP Sdn BhdThis is a Full time jobPenangSenior Level | 10+ Years Experience | FCBGA Assembly, Die-to-Wafer 2.5D PackagingsubClassification: Process EngineeringProcess Engineering classification: Engineering(Engineering)23d ago•Expiring