Listed twenty three days ago
This is a Full time job
Penang
Senior Level | 10+ Years Experience | FCBGA Assembly, Die-to-Wafer 2.5D Packaging
23d ago•Expiring
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Listed twenty four days ago
This is a Full time job
Penang
Founding Principal Technology Development Engineer – Epoxy Underfill (CUF) Process, 10+ Years Experience, FCBGA Assembly, Die-to-Wafer 2.5D Packaging
24d ago•Expiring
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