Capcon Limited (www.capconsemicon.com), a leading company to provide innovative solutions for semiconductor advanced packaging industry and electronics manufacturing service industry. R&D Center in Singapore , is responsible for innovative product development and mass production.With strong market trend in semiconductor advanced packaging and high end Electronics Manufacturing Service (EMS) industry, the company satisfies its customers with innovative products such as high precision high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder and so on to tremendously increase customer’s Total Cost Of Ownership. The company has a number of international intellectual properties. The products have been tested and recognized by the world's most well-known semiconductor packaging manufacturers while the company to establish its leading position in semiconductor industry.
Capcon Limited (www.capconsemicon.com), a leading company to provide innovative solutions for semiconductor advanced packaging industry and electronics manufacturing service industry. R&D Center in Singapore , is responsible for innovative product development and mass production.With strong market trend in semiconductor advanced packaging and high end Electronics Manufacturing Service (EMS) industry, the company satisfies its customers with innovative products such as high precision high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder and so on to tremendously increase customer’s Total Cost Of Ownership. The company has a number of international intellectual properties. The products have been tested and recognized by the world's most well-known semiconductor packaging manufacturers while the company to establish its leading position in semiconductor industry.
Capcon Limited (www.capconsemicon.com), a leading company to provide innovative solutions for semiconductor advanced packaging industry and electronics manufacturing service industry. R&D Center in Singapore , is responsible for innovative product development and mass production.With strong market trend in semiconductor advanced packaging and high end Electronics Manufacturing Service (EMS) industry, the company satisfies its customers with innovative products such as high precision high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder and so on to tremendously increase customer’s Total Cost Of Ownership. The company has a number of international intellectual properties. The products have been tested and recognized by the world's most well-known semiconductor packaging manufacturers while the company to establish its leading position in semiconductor industry.