Listed sixteen days ago
This is a Full time job
Bayan Lepas, Penang
RM 6,500 – RM 8,500 per month
You will be responsible for developing, optimizing and supporting thin film deposition processes.
16d ago
4 jobs
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Listed twenty three days ago
This is a Full time job
Penang
Senior Level | 10+ Years Experience | FCBGA Assembly, Die-to-Wafer 2.5D Packaging
23d ago
Listed one day ago
This is a Contract/Temp job
Bayan Lepas, Penang
RM 1,700 per month
Gain hands-on experience in Die Attach and Wire Bond processes, support data analysis, and drive process improvement projects.
1d ago
Listed twenty four days ago
This is a Full time job
Penang
Founding Principal Technology Development Engineer – Epoxy Underfill (CUF) Process, 10+ Years Experience, FCBGA Assembly, Die-to-Wafer 2.5D Packaging
24d ago•Expiring
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