Developing and managing material requirements plants to ensure a continuous flow of material of production
Developing and managing material requirements plants to ensure a continuous flow of material of production
2d ago
2d ago
Company Profile
Company overview
Industry
Consumer Electronics Manufacturing
Specialities
gold bump packaging & testing, semiconductor
Company size
101-1,000
Primary location
1606 Tingkat Atas Floor , Jalan Perusahaan Valdor, Kawasan Perindustrian Valdor, Sungai Jawi 14200
Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science ParkWe have expanded the operations to 6 locations with approximately 5,200 peopleWe are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!
Jobs at Chipbond Technology Corporation
Based on your search activityResponsible for the overall integration and advancement of new products
Responsible for the overall integration and advancement of new products
2d ago
2d ago
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