Developing and managing material requirements plants to ensure a continuous flow of material of production
Developing and managing material requirements plants to ensure a continuous flow of material of production
1d ago
1d ago
Company Profile
Company overview
Industry
Consumer Electronics Manufacturing
Specialities
gold bump packaging & testing, semiconductor
Company size
101-1,000
Primary location
1606 Tingkat Atas Floor , Jalan Perusahaan Valdor, Kawasan Perindustrian Valdor, Sungai Jawi 14200
Chipbond Technology was founded in July 1997, as a downstream packaging and testing service provider in the semiconductor industry, headquarters in Taiwan, Hsinchu Science ParkWe have expanded the operations to 6 locations with approximately 5,200 peopleWe are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally.We are expanding our footprint to Penang, Malaysia, Let's join us as Pioneer Team!
Jobs at Chipbond Technology Corporation
Based on your search activityResponsible for the overall integration and advancement of new products
Responsible for the overall integration and advancement of new products
1d ago
1d ago
Reviews overview
We don't have enough reviews for Chipbond Technology Corporation yet to show an average rating.
Have your say
Let others know what it's like to work at Chipbond Technology Corporation.Write a review
Other companies in this industry
Find out more about working at Chipbond Technology Corporation. Read company reviews from real employees, explore salaries and life and culture; and view all open jobs.
This profile contains information from job postings, company websites, third-party databases and AI-generated content. Information may be incomplete or outdated. View our Company Profiles Terms.